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ics for communications memory time switch large mtsl peb 2047 peb 2047-16 version 2.1 data sheet 03.95
edition 03.95 this edition was realized using the software system framemaker ? . published by siemens ag, bereich halbleiter, marketing- kommunikation, balanstra?e 73, 81541 mnchen ? siemens ag 1995. all rights reserved. attention please! as far as patents or other rights of third par- ties are concerned, liability is only assumed for components, not for applications, pro- cesses and circuits implemented within com- ponents or assemblies. the information describes the type of compo- nent and shall not be considered as assured characteristics. terms of delivery and rights to change design reserved. for questions on technology, delivery and prices please contact the semiconductor group offices in germany or the siemens companies and representatives worldwide (see address list). due to technical requirements components may contain dangerous substances. for in- formation on the types in question please contact your nearest siemens office, semi- conductor group. siemens ag is an approved cecc manufac- turer. packing please use the recycling operators known to you. we can also help you C get in touch with your nearest sales office. by agreement we will take packing material back, if it is sorted. you must bear the costs of transport. for packing material that is returned to us un- sorted or which we are not obliged to accept, we shall have to invoice you for any costs in- curred. components used in life-support devices or systems must be expressly authorized for such purpose! critical components 1 of the semiconductor group of siemens ag, may only be used in life-support devices or systems 2 with the ex- press written approval of the semiconductor group of siemens ag. 1 a critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effec- tiveness of that device or system. 2 life support devices or systems are in- tended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. if they fail, it is rea- sonable to assume that the health of the user may be endangered.
data classification maximum ratings maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. characteristics the listed characteristics are ensured over the operating range of the integrated circuit. typical characteristics specify mean values expected over the production spread. if not otherwise specified, typical characteristics apply at t a = 25 c and the given supply voltage. operating range in the operating range the functions given in the circuit description are fulfilled. for detailed technical information about "processing guidelines" and "quality assurance" for ics, see our "product overview" . peb 2047 peb 2047-16 revision history: current version: 03.95 previous version: data book 01.94 page (in version 01.94) page (in new version) subjects (changes since last revision) 124 5 version 2.1 127 8 pin no. 6: int open drain output 135 16 figure 8: improved 142 23 star: fsad(2:1) position 143 25 mask: write address 148 31 figure 12: 2 data rate, figure 13: 1 data rate 153 36 abs. max. ratings: v s definition 154 37 t la min. = 15 ns, t ah min. = 15 ns, t rwd min. = 0 ns 157 40 figure 23: t rwd 158 41 t s min. = 15 ns 159 42 sequence of 1., 2. and 3. bit of frame
peb 2047 peb 2047-16 semiconductor group 4 table of contents page 1 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 1.1 pin definitions and functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 1.2 logic symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 1.3 general device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 1.4 system integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 2 functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 2.1 mtsl internal timing and channel delay . . . . . . . . . . . . . . . . . . . . . . . . .15 2.2 special functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 3 operational description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 3.1 initialization procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 3.2 operation mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 3.3 indirect access register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 3.4 frame evaluation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 4 detailed register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 4.1 mode register (mod) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 4.2 command register (cmdr) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 4.3 status register (star) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 4.4 interrupt status register (ista) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 4.5 mask register (mask) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 4.6 indirect access register (iar) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 4.7 indirect registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 5 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 6 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44 6.1 determination of mtsl frame delay . . . . . . . . . . . . . . . . . . . . . . . . . . . .44 6.2 example for a mtsl design guaranteeing constant frame delay for all time slots . . . . . . . . . . . . . . . . . . . . . . . . . .48 7 package outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
semiconductor group 5 03.95 memory time switch large (mtsl) peb 2047 peb 2047-16 preliminary data cmos ic type ordering code package peb 2047-n v2.1 q67100-h6238 p-lcc-44 (smd) pef 2047-n-16 v2.1 q67100-h6301 p-lcc-44 (smd) p-lcc-44 1features l non-blocking time/space switch for 2048-, 4096-, 8192- or 16 384-kbit/s pcm systems l different modes programmable for input and output separately l configurable for a 4096-khz, 8192-khz or 16 384-khz device clock l switching of up to 1024 incoming pcm channels to up to 1024 outgoing pcm channels l 16 input and 8 output pcm lines l tristate function for further expansion and tandem operation l m p read-access to pcm data l programmable clock shift with half clock step resolution for input and output l individual line delay measurement and clock shift mechanism for 8 pcm inputs l built-in selftest l 8-bit motorola or intel type m p interface l constant or minimal channel-delay programmable on a per time-slot basis l in-operation adjustment of bit-sampling without bit errors l low power consumption l single 5 v power supply important note: all 16 384-mhz features described in this data sheet are only available with the peb 2047-16!
peb 2047 peb 2047-16 semiconductor group 6 pin configuration (top view) 18 19 20 21 22 23 24 25 26 27 28 in 14/fs6 in 13/fs5 v a0 cs rd/ds wr/r/w ad0 ad1 a1 29 ad2 30 ad3 31 ad4 32 ad5 33 ad8 34 ad7 35 out5 36 out4 37 out1 38 out0 39 res 7 8 9 10 11 12 13 14 15 16 17 40 41 42 43 44 1 2 3 4 5 6 int in 15/fs7 in 11/fs3 sp ale clk out2 out3 out7 v ss itp03766 dd peb 2047 mtsl out6 in3 in7 in6 in2 in1 in5 in4 in0 in 12/fs4 in 8/fs0 in 9/fs1 in 10/fs2
semiconductor group 7 peb 2047 peb 2047-16 1.1 pin definitions and functions pin no. symbol input (i) output (o) function 1 v ss i ground (0 v) 3spi synchronization pulse: the mtsl is synchronized to the pcm system via this line. 14 11 10 7 13 12 9 8 in0 in1 in2 in3 in4 in5 in6 in7 i i i i i i i i pcm-input ports: serial data is received at standard ttl levels. 15 16 17 4 20 19 18 5 in8/fs0 in9/fs1 in10/fs2 in11/fs3 in12/fs4 in13/fs5 in14/fs6 in15/fs7 i i i i i i i i pcm-input ports or frame (measuring inputs): these inputs can additionally be used as frame evaluation inputs. 21 28 a0 a1 i i address bus bit 0, 1: these inputs interface to the systems address bus to select an internal register for a read or write access. these pins are only active if a demultiplexed m p interface mode is selected. 22 cs i chip select: a low level selects the mtsl for a register access operation. 23 v dd i supply voltage: 5 v 5 %. 39 res i reset: a high signal on this input forces the mtsl into reset state. 25 r/w wr i i read/write: when high, identifies a valid m p access as a read operation. when low, identifies a valid m p access as a write operation (motorola bus mode). write: this signal indicates a write operation (siemens/ intel bus mode). 24 ds rd i i data strobe: the rising edge marks the end of a valid read or write operation (motorola bus mode). read: this signal indicates a read operation (siemens/ intel bus mode).
peb 2047 peb 2047-16 semiconductor group 8 pin definitions and functions (contd) pin no. symbol input (i) output (o) function 26 27 29 30 31 32 33 34 ad0 ad1 ad2 ad3 ad4 ad5 ad6 ad7 i/o i/o i/o i/o i/o i/o i/o i/o address data bus: if the multiplexed address/data m p- interface bus mode is selected these pins transfer data and addresses between the m p and the mtsl. if a demultiplexed mode is used, these bits interface with the system data bus. 38 37 43 42 36 35 41 40 out0 out1 out2 out3 out4 out5 out6 out7 o o o o o o o o pcm-output port: serial data is sent by these lines at standard cmos- or ttl levels. these pins can be tristated. 44 clk i clock: 4096-khz, 8192-khz or 16 384-khz device clock. 2alei address latch enable: in the intel type multiplexed m p- interface mode a logical high on this line indicates an address of an mtsl internal register on the external address/data bus. in the intel type demultiplexed m p- interface mode this line is hardwired to v ss , in the demultiplexed motorola type m p-interface mode it should be connected to v dd . 6int (od) interrupt line: active low open drain output.
semiconductor group 9 peb 2047 peb 2047-16 1.2 logic symbol figure 1 functional symbol 1.3 general device overview the siemens memory time switch large mtsl (peb 2047) is an expansion of the mtsc (peb 2045) regarding capacity and/or functionality. it is a monolithic cmos switching device capable of connecting maximally 1024 pcm-input time-slots to 1024 output time-slots. a constant frame delay of one frame can be selected for wideband applications (e.g. isdn h-channels), whereas for example for voice channels a minimal frame delay is programmable. in order to manage the problem of different line delays, eight of the pcm inputs can be used as frame measurement inputs and eight different input offsets are allowed. thus a frame wander can be compensated by adjusting the input offset during operation. a special circuitry guarantees that no bit error will occur, when reprogramming the input offsets. the mtsl on-chip connection memory and data-memory are accessed via the 8-bit standard m p- interface (motorola or intel type). a built-in selftest mechanism C also activated by the m p C ensures proper device operation in the system. the peb 2047 is fabricated using the advanced cmos technology from siemens and is mounted in a p-lcc-44 package. inputs and outputs are ttl-compatible. ad (7 : 0) out (7 : 0) in (15 : 0) vv sp clk dd ss pcm interface m ale wr rd cs a0 a1 int p interface itl03767 peb 2047
peb 2047 peb 2047-16 semiconductor group 10 1.4 system integration the main application field for the mtsl (peb 2047) are central switches with high switching capacity. two possibilities exist to implement a non-blocking switch for 1024 input and 1024 output channels. with a 16 384-khz device clock only one mtsl is needed ( figure 2 ), with a 8192-khz device clock two chips in parallel realize the same functionality ( figure 3 ). figure 2 memory time switch for a non-blocking 1024-channel switch (16 mhz) figure 3 memory time switch for a non-blocking 1024-channel switch (8 mhz) 8 pcm out 8 mhz 8 mhz pcm in 8 its03768 mtsl clk 384 khz 16 4 4 pcm out 8 mhz 8 mhz pcm in 8 its03769 mtsl clk clk mtsl 8192 khz
semiconductor group 11 peb 2047 peb 2047-16 due to the tristate capability of the mtsl larger switches can be easily formed. figure 4 and 5 show how 4 devices operating with a 16 384-khz clock or 8 devices operating with a 8192-khz clock can be arranged to form non-blocking 2048-channel switches. figure 4 memory time switch for a non-blocking 2048-channel switch with four devices (16-mhz device clock) figure 5 memory time switch for a non-blocking 2048-channel switch with eight devices (8-mhz device clock) 8 pcm out 8 mhz 8 mhz pcm in 8 8 8 mtsl mtsl mtsl mtsl its03770 4 4 pcm out 8 mhz 8 mhz pcm in 8 11 21 12 22 14 24 13 23 8 4 4 mtsl mtsl mtsl mtsl mtsl mtsl mtsl mtsl its03771
peb 2047 peb 2047-16 semiconductor group 12 2 functional description the mtsl is a memory time switch device. operating with a device clock of 8192 khz it can connect any of 1024 pcm-input channels to any of 512 output channels. with a device clock of 16 384 khz all 1024 pcm channels can be switched to the output. additionally a 2048-kbit/s mode with a capacity of 512 256 time-slots and a clock frequency of 4096 khz is possible for systems, which need the frame integrity feature. a general block-diagram of the mtsl is shown in figure 7 . the input information of a complete frame is stored in one of the two on-chip 8-kbit data memories dm0 and dm1. the incoming 1024 channels of 8 bits each are written in sequence into fixed positions of dm0 or dm1. this is controlled by the input counter in the timing control block with a 8-khz repetition rate. if mtsl-a1 compatible operation (i.e. no frame integrity guaranteed) is wished, only one of the two data memories is used. otherwise dm0 and dm1 are filled alternating with input frames. for outputting, the connection memory (cm) is read in sequence. each location in the cm points to a location in the data memory. the byte in this data memory location is transferred into the current output time-slot. the read access to the cm is controlled by an output counter. an additional bit (d12) in each location of the cm controls the access to the data memories dm0 and dm1. three address pointers C two switching aligned to the input frame (dmi, iadp), one switching aligned to the output frame (dmo) C are working in conjunction with d12 implementing the constant/minimal delay function ( see figure 6 ). figure 6 itd03772 frame (n-1) frame n frame (n+1) sp dmo dmi iadp 0 1 61 62 63 0 1 63 0 63 0 frame n frame n+1 frame n+2 .......... .......... .......... frame (n-1) frame (n-1) frame n read ts0 from dm read ts0 from dm read ts0 from dm writes ts0 to dm writes ts63 to dm writes ts63 to dm
semiconductor group 13 peb 2047 peb 2047-16 constant delay (d12 = 0): read output time-slot from data memory (not dmo) minimal delay (d12 = 1): if number of input time-slot to be switched to current output iadp then read output time-slot from data memory dmi else read output time-slot from data memory (not dmi) the synchronization of this procedure will be achieved by a rising edge of the synchron pulse sp, which is always sampled with the falling edge of the device clock. different modes of operation are configurable at the pcm-input interface ( see table 3 ). furthermore, 8 pcm-input lines can be aligned with individual clock shift values to compensate different line delays. if more than 8 inputs are used one clock shift value controls up to two ports at the same time. the input lines in8 to in15 can be used as additional frame-measurement inputs (fs(0:7)). after synchronizing the device by the sp pulse the fs inputs can be evaluated on a per port basis. this evaluation procedure is started by a microprocessor command. as a result the input counter value on the rising edge of the fs signal can be read from an internal register. thus delay compensation is easily managed by programming appropriate clock shift values and/or a possible software offset. during operation of the chip a frame length check is also supplied, which controls correct synchronization by the sp pulse and generates an interrupt in case of lost or achieved synchronization. the output buffer operation is controlled by mode selection and the chosen clock-rate (4096 khz, 8192 khz or 16 384 khz) ( see table 2 ). shifting of the output frame is also possible, but all output- lines are affected the same way. the unused output ports are tristated by mode selection, whereas unused time-slots are tristated by an additional bit in the control memory. by using this tristate capability the mtsl can be easily expanded to a time switch of any size ( see figure 2 to 5 ).
peb 2047 peb 2047-16 semiconductor group 14 figure 7 block diagram mtsl the standard 8-bit m p interface can communicate with intel multiplexed/demultiplexed microprocessors as well as with motorola demultiplexed processors. it gives access to the internal registers and to the control- and data memory. five directly addressable registers are provided. all other registers and the memories are accessed by a simple three byte indirect access method (similar to the mtsc peb 2045). itb03741 interface m p mod cmdr star mask ista iar cm memory connection cs reg. timing control output buffer input buffer data memory dm0 dm1 ad0... ad7 a0...a1 ale rd wr cs int in0 in1 in2 in3 in4 in5 in6 in7 in8/fs0 in9/fs1 in10/fs2 in11/fs3 in12/fs4 in13/fs5 in14/fs6 in15/fs7 out0 out7 res clk sp
semiconductor group 15 peb 2047 peb 2047-16 2.1 mtsl internal timing and channel delay figure 7 shows the chip internal timing of writing and reading the data memory for all possible operation modes. control memory reset initialization of the device after a hardware reset (res) is easily done with a m p-command control memory reset. after finishing this procedure all control memory channels contain the information tristated. evaluate frame measurement signal a command and an address (0 7) will be given by the m p. the rising edge of the corresponding frame measurement signal (fs0 fs7) will be evaluated. the exact timing of the fs edge can then be read from an internal 12-bit register (resolution of a complete 8-khz frame in half 16-mhz clock periods). mtsl-selftest the switching path of the mtsl including input buffer, data memory, control memory, output buffer and timing control can be tested in the system by a built-in selftest. the two data memories dm0 and dm1 require two test procedures. activating this mechanism takes (2 2.5) ms (4096 khz), (2 1.25) ms (8192 khz) or (2 0.625) ms (16 384 khz). finally the result selftest ok/selftest not ok can be read from the internal status register. after test completion the control-memory is also reset. 2.2 special functions the activity of all special functions can be read in the status register. completion of these functions is indicated by interrupts.
peb 2047 peb 2047-16 semiconductor group 16 figure 8 data memory timing itd06636 data rate/mbit/s x 1.024 clock freq./mhz x 1.024 input device clock 2244 8 8 44 16 - - - ts2 ts3 ts4 ts5 ts4 ts1 ts2 ts5 ts6 ts7 ts8 ts9 ts10 ts11 or ts0 & ts1 in0...in7 in0...in15 ts0 or 8 --16 - 8 - 4 ts0...ts3 in0, in2, in4, in6 wa possible write periods b w b a w r write read data-memory data-memory possible read periods 0 rr 1 r 2 r 3 r 4 r 5 r 6 r 7 out# ts#33333333 ts2 ts1 ts5 ts4 ts3 ts2 ts11 ts10 ts9 ts8 ts7 ts6 ts5 ts4 -8-16 48 4 2 output 8 4 ts2 ts3 ts4 ts5 a a 7 6 ts# out# r r r r 3 r 2 r 1 r r 0 67 67 67 1 rr 3 r 5 r 7 out# ts# b 5 6 r 4 r 2 r r 0 5555555 11 0 rr 2 r r 10 b ts# out# r r 3 r r 1 0123 13 2 0 10 11 10 11 10 11 2-mbit mode normal mode - - -- -- * possible read and write periods are aligned to output time-slots 1) 1)
semiconductor group 17 peb 2047 peb 2047-16 for a system operating with 8192-khz device clock and 8192-mbit/s/8192 mbit/s input/output data rate the following frame delay table can be deduced from the timing diagram: table 1 from this table it can be seen, that it is not possible to achieve the constant delay of one frame for all switching paths. those input time-slots, which are written to the data memory later than they should have been read (for example in the above configuration ts124 C ts127 switched to ts0 or ts1, out1, 2, 3), will be delayed by three frames! input time-slot switched to output time-slot switched to out1, 2, 3 0C 1 2C 3 4C 5 . . . 118 C 119 120 C 121 122 C 123 124 C 125 126 C 127 6 C 127 8 C 127 10 C 127 . . . 124 C 127 126 C 127 C C C 0C 5 0C 7 0C 9 . . . 0 C 123 0 C 125 0 C 127 2 C 127 4 C 127 C C C . . . C C C 0C 1 0C 3 switched to out0 0C 1 2C 3 4C 5 . . . 118 C 119 120 C 121 122 C 123 124 C 125 126 C 127 7 C 127 9 C 127 11 C 127 . . . 125 C 127 127 C C C 0C 6 0C 8 0C 10 . . . 0 C 124 0 C 126 1 C 127 3 C 127 5 C 127 C C C . . . C C 0 0C 2 0C 4 delay/number of frames minimal delay 0 1 2 constant delay 1 1 3
peb 2047 peb 2047-16 semiconductor group 18 3 operational description 3.1 initialization procedure for a proper initialization of the mtsl the following procedure is recommended: first a reset pulse (res) of at least two clk clock-periods has to be applied. all registers contain now their reset values. in the next step the connection-memory cm is initialized by the commands cmdr:stp (1:0) = 01 (cm reset) or cmdr:stp (1:0) = 11 (mtsl selftest). after having programmed a cm-reset command, it takes 4096-clock periods until all tristate-control entries in the cm contain the value 1 (tristated). if a selftest-command was given, it takes 10 240-clock periods to achieve the same effect. furthermore the register bit star:stok (selftest o.k.) should still be set to 1 in this case, in order to prove that there is no fault on the chip. from version v2.1 up, the selftest command must be given for each data memory (dm0, dm1) separately. dm1 is tested, when register opcr contains the reset value ff h , dm0 is tested by programming opcr to fb h . the activity of the procedures can be monitored in star:pact and an interrupt will indicate their completion. in all cases it is important, that the outputs are tristated by mod:psb = 0. 3.2 operation mode the operation mode of the device is fixed by programming mod:omd (1:0) and mod:imd (2:0) and by the device clock used at pin clk ( see table 2 and 3 ). 3.3 indirect access register the connection-memory, data-memory and indirect registers are accessible through the indirect access register (iar). an indirect access is performed by reading and/or writing three consecutive bytes to/from iar. an incomplete three-byte access is indicated by star:z = 1. after having read and/or written the third byte the operation selected by iar:c (1:0), wr/rdq is started and the bit star:b is set to 1. it takes at most 4.5 clock periods (8.5 clock periods for a read data memory) until the operation is performed and star:b is reset.
semiconductor group 19 peb 2047 peb 2047-16 3.4 frame evaluation suppose the following timing at pcm input in5 (mode 2): figure 9 if the device is in synchronized state (star:pss = 1) and the command frame evaluation at fs5 (cmdr = 58 h ) is programmed, the second following rising edge of fs5 is evaluated and creates the following result in register fer: d (11) = 0 d (10:1) = 3e7 h d (0) = 0 d0 is fixed to 0 and doesnt have a meaning in 8-mhz clock operation modes. the actual offset of the incoming frame can now be calculated according to the formulas given in table 9 . itd03773 sp clk fs 5 in 5 ts 127 ts 0
peb 2047 peb 2047-16 semiconductor group 20 3.5 input offset and output offset based on the results of the frame evaluation procedures the input offsets can be adjusted by programming icsr (7:0) corresponding to inputs in (7:0). if data oversampling is used, the values of icsr (7:0) can be adjusted within some limits during operation without producing bit errors: a) clockrate = 2 datarate possible adjustment is one half clockperiod forward or backward. figure 10 b) clockrate = 4 datarate possible adjustment is one clockperiod backward or two clockperiods forward. figure 11 the output offset is the same for all output lines and is fixed in register ocsr. itd03774 clk 1 2 - 1 2 0 + data itd03775 clk 1 1 2 -- 1 2 00+ 1+ 3 2 ++2 data
semiconductor group 21 peb 2047 peb 2047-16 4 detailed register description 4.1 mode register (mod) access in the multiplexed m p-interface mode: read/write, address: 0 h access in a demultiplexed m p-interface mode: read/write, address: 0 h reset value: 00 h psb pcm stand by ; a logical 0 switches the pcm-interface outputs to high impedance. md2 if set to 1, the peb 2047 is able to switch channels with 2048-khz data rate, when operating with 8.192 mhz (switching capacity 512 512 time-slots) or 4.096 mhz (switching capacity 512 256 time-slots). omd1 omd0 output mode 1 and 0 ; these bits define the pcm-output mode according to the following table. 1) input and output mode combinations which use the same device clock frequency have to be selected. bit 7 bit 0 psb md2 0 omd1 omd0 imd2 imd1 imd0 table 2 output modes device clock [khz] output mode omd (1:0) 1) port numbers number of ports data rate/kbit/s 4.096 0 out (7:0) 8 2048 1 out7, out5, out3, out1, out2, out0 4 2048 / 2 4096 3 out (3:0) 4 4096 8.192 0 out (7:0) 8 4096 1 out7, out5, out3, out1, out2, out0 4 4096 / 2 8192 3 out (3:0) 4 8192 16.384 0 out (7:0) 8 8192 1 out7, out5, out3, out1, out2, out0 4 8192 / 2 16384 3 out (3:0) 4 16384
peb 2047 peb 2047-16 semiconductor group 22 imd2 imd0: input mode 2 , 1 and 0 ; these bits define the pcm-input mode according to the following table. 1) input and output mode cominations which use the same device clock frequency have to be selected. table 3 input modes device clock [khz] md2 input mode imd (2:0) 1) port numbers number of ports data rate/kbit/s 4.096 1 0 in (15:0) 16 2048 1 1 in (15:12), in (7:4) / in (3:0) 8 2048 / 4 4096 1 2 in (7:0) 8 4096 8.192 0 0 in (15:0) 16 4096 0 1 in (15:12), in (7:4) / in (3:0) 8 4096 / 4 8192 0 2 in (7:0) 8 8192 1 4 in (15:0) 16 2048 1 5 in (15:12), in (7:4) / in (3:0) 8 2048 / 4 4096 1 6 in (7:0) 8 4096 16.384 0 4 in (15:0) 16 4096 0 5 in (15:12), in (7:4) / in (3:0) 8 4096 / 4 8192 0 6 in (7:0) 8 8192 0 3 in6, in4 / in (3:0) 2 16384 / 4 8192 0 7 in6, in4, in2, in0 4 16984
semiconductor group 23 peb 2047 peb 2047-16 4.2 command register (cmdr) access in the multiplexed m p-interface mode: write, address 2 h access in a demultiplexed m p-interface mode: write, address 1 h address: 01 h fsad (2:0) frame synchronization signal address 2 to 0; address of the chosen fs signal 0 to 7 to be evaluated by the procedure started by sfe. sfe start frame evaluation ; a one in this bit position starts the frame evaluation procedure. a read operation on register fer will stop an unfinished frame evaluation procedure. ri reset incomplete instruction; if a three byte indirect register access is not completed the internal logic must be initialized again before a new three byte access is possible. stp0 stp1 start procedure 1 and 0 . the following procedures can be activated by these bits: note: before activating one of these procedures mod:psb has to be set to 0. during selftest or cm reset the device will ignore the external synchronization pulse and the user has no access to the internal data memory. bit 7 bit 0 0 fsad2 fsad1 fsad0 sfe ri stp1 stp0 table 4 stp commands stp1 stp0 function x 0 1 0 1 1 no operation start control memory reset procedure start selftest procedure
peb 2047 peb 2047-16 semiconductor group 24 4.3 status register (star) access in the multiplexed m p-interface mode: read, address: 2 h access in a demultiplexed m p-interface mode: read, address: 1 h reset value: 01 h z incomplete instruction; a three byte indirect instruction is not completed (z = 1). fsad (2:0) frame synchronization signal address 2 to 0: see cmdr. bbusy ; an indirect access is active (memories or indirect registers); the three byte indirect access register is not accessible. pact procedure active ; one of the procedures started by the m p (selftest, cm reset or frame evaluation) is active. pss pcm synchronization status ; the pcm interface is synchronized (logical 1) or not synchronized (logical 0). stok selftest o.k .; after a selftest procedure this bit is set to 1, if no faults are detected. note: this bit is only valid, if no power failure or inappropriate clocking occurred during the test (see ista:ir); this bit is set to 1 by a start selftest command or by hardware reset. bit 7 bit 0 z fsad2 fsad1 fsad0 b pact pss stok
semiconductor group 25 peb 2047 peb 2047-16 4.4 interrupt status register (ista) access in the multiplexed m p-interface mode: read, address: 4 h access in a demultiplexed m p-interface mode: read, address: 2 h reset value: 00 h fec frame evaluation completed ; the indirect register fer contains a valid offset and can be read; this bit is reset by reading ista. pc procedure completed ; the procedure started from the command register (cm reset or mtsl selftest) is finished; this bit is reset by reading ista. ir initialization request . the connection memory has to be programmed due to a loss of data (ir = 1). the ir bit is set after power failure or inappropriate clocking. this bit is reset by reading ista. it can only be retriggered again after a selftest or cm-reset procedure. pfi pcm-framing interrupt ; this bit being logical 1 indicates the loss or gain of synchronization. synchronization is considered lost by the mtsl if the sp signal is not repeated within the correct period. synchronization is considered achieved, if two consecutive sp pulses with the correct period have been received. pfi is reset by reading ista. 4.5 mask register (mask) access in the multiplexed m p-interface mode: write, address: 4 h access in a demultiplexed m p-interface mode: write, address: 2 h reset value: 00 h a logical 1 disables the corresponding interrupt as described in ista. a masked interrupt is stored internally and reported in ista immediately, if the mask is released. bit 7 bit 0 0000fecpcirpfi bit 7 bit 0 0000fecpcirpfi
peb 2047 peb 2047-16 semiconductor group 26 4.6 indirect access register (iar) access in the multiplexed m p-interface mode: read/write, address: 6 h access in a demultiplexed m p-interface mode: read/write, address: 3 h reset value: only the control bits c (1:0) and wr/rdq are initialized to 0. an indirect access is performed by reading/writing three consecutive bytes (first byte = extended control byte, second byte = data byte, third byte = address byte) to/from iar. c (1:0) code values to determine the type of access. wr/rdq if set to 1 a write access is performed; otherwise a read access is activated. bit 7 bit 0 c1 c0 / d12 wr/ rdq ia9 ia8 / d11 d10 d9 d8 control byte d7 d6 d5 d4 d3 d2 d1 d0 data byte ia7 ia6 ia5 ia4 ia3 ia2 ia1 ia0 address byte
semiconductor group 27 peb 2047 peb 2047-16 d12 this bit is only used as a data bit in a read or write control memory operation. dependent on the contents of register opcr d12 is interpreted as absolute address for data memories dm0 and dm1 (opcr = ff h ) or as a switch for constant (d12 = 0) and minimal (d12 = 1) delay (opcr = fc h ). d11 this bit is only used as data bit in a read operation of the fer register. d (10:0) data value for read/write access; if the control-memory is accessed d10 is used as a tristate control bit (0 = active, 1 = high impedance). the incoming pcm data are transformed onto the data-memory (control memory data d12, d (10:0)) in the following way: tsn time-slot number pn port number tsc tristate control value (0 = active, 1 = high impedance) md minimal delay (1 = minimal, 0 = constant frame delay), if opcr:oc (1:0) = 00 b . absolute address of data memories dm0, dm1 if opcr:oc (1:0) = 11 b . table 5 indirect access codes c1 c0 wr/rdq function max. access time clock periods 0 0 0 0 1 1 1 0 0 1 1 0 1 1 0 1 1 0 0 0 1 no operation write control memory d12 = 0 write control memory d12 = 1 read control memory read data memory read indirect register write indirect register C 4.5 4.5 4.5 8.5 4.5 4.5
peb 2047 peb 2047-16 semiconductor group 28 note: d9 must be set to 0, if mod = md2 is set, i.e. in 2-mbit applications. pn ? 2 means, you have to multiply d (2:1) by two to generate the correct input numbers. ia9 ia0 indirect address for a read/write access if a indirect register is accessed only ia (3:0) are interpreted as address bits. table 6 input time-slot mapping input mode d (10:0) valid for inputs 0,4 in (15:0) 1,5 in (15:12), in (7:4) in (3:0) 2,6 in (7:0) 7 in6, in4, in2, in0 3 in (3:0) in6, in4 1) d3 and d0 contain the inverted values in these cases. d12 d10 d9 d8 d7 d6 d5 d4 d3 1) d2 d1 d0 md tsc tsn pn d12 d10 d9 d4 d3 1) 1d1d0 md tsc tsn pn d12 d10 d9 d3 0 d1 d0 md tsc tsn pn d12 d10 d9 d3 d2 d1 d0 md tsc tsn pn d12 d10 d9 d8 d7 d6 d5 d4 d3 d2 d1 d0 * md tsc tsn (7:2) tsn0 pn ? 2 tsn1 d12 d10 d9 d3 0 d1 d0 md tsc tsn pn d12 d10 d9 d4 d3 1 d1 d0 * md tsc tsn (7:2) tsn0 pn ? 2tsn1
semiconductor group 29 peb 2047 peb 2047-16 the control memory address is transformed to the output time-slots: note: ia9 is only valid within applications with a 16.384-mhz device clock. if a 8.192 or 4.096-mhz clock is used, it is internally fixed to 0. ia8 must be set to 0, if mod:md2 is set, i.e. in 2-mbit applications. table 7 output time-slot mapping output mode valid for outputs 0 out (7:0) 1 out7, out5, out3, out1 out2, out0 3 out (3:0) ia9 ia8 ia3 ia2 ia1 ia0 tsn pn ia9 ia8 ia3 ia2 ia1 1 tsn pn ia9 ia8 ia2 ia1 0 tsn pn ia9 ia8 ia2 ia1 ia0 tsn pn
peb 2047 peb 2047-16 semiconductor group 30 4.7 indirect registers input clock shift registers icsr (7:0) read/write at indirect address ia (3:0) = 0 h 7 h reset value: 40 h adsr add shift register ; a three bit shift register is inserted into the corresponding input(s). ics4 ics0 input clock shift ; the value of ics (4:0) determines the number of clock cycles by which the bit sampling point is shifted forward in all input modes. note: ics4 has to be set to 0 in input modes 0, 1 and 2. rre receive on rising edge these eight registers determine the individual clock shift of inputs in0 to in7. if more than eight inputs are used, two inputs are controlled by one icsr register: icsr0 controls in0, in8 icsr1 in1, in9 icsr2 in2, in10 .. .. .. icsr7 in7, in15 bit 7 bit 0 adsr 1 ics4 ics3 ics2 ics1 ics0 rre
semiconductor group 31 peb 2047 peb 2047-16 input timing figure 12 device clock = 2 data rate figure 13 device clock = data rate sp clk ts 0, bit 7 ics (4 : 0) rre 0 1 0 00 00 02 ts 0, bit 7 ts 0, bit 7 in# in# in# ts 0, bit 6 h h h itd03777 sp clk ts 0, bit 7 ics (4 : 0) rre 0 1 0 00 00 01 ts 0, bit 7 ts 0, bit 7 in# in# in# bit 6 bit 6 h h h
peb 2047 peb 2047-16 semiconductor group 32 figure 14 device clock = 4 data rate operation control register (opcr) read/write at indirect address ia (3:0) = d h reset value: ff h sdm select data memory; only used in configuration with oc (1:0) = 11 b oc (1:0) operation control; oc (1:0) determine the usage of the two data memory blocks according to the table below. table 8 bit 7 bit 0 11111sdmoc1oc0 oc1 oc0 function 1 1 only one data memory block is used; the absolute address is given by sdm; bit d12 in the control memory is also interpreted as absolute address. 0 0 both data memory blocks are used; bit d12 in the control memory controls the constant or minimal frame delay function. 01reserved 10reserved itd03778 sp clk ts 0, bit 7 ics (4 : 0) rre 0 1 0 00 00 04 ts 0, bit 7 ts 0, bit 7 in# in# in# h h h
semiconductor group 33 peb 2047 peb 2047-16 output clock shift register (oscr) read/write at indirect address ia (3:0) = e h reset value: 20 h this register determines the clock shift for all outputs. ocs (3:0) output clock shift xfe transmit on falling edge figure 15 output timing and clock shift bit 7 bit 0 vn2 vn1 vn0 ocs3 ocs2 ocs1 ocs0 xfe itd03779 sp clk device clock = 2 x data rate device clock = data rate ts0, bit7 ts0, bit6 ts0, bit7 ts0, bit6 ts0, bit7 ts0, bit6 ts0, bit7 ts0, bit7 ts0, bit7 ocsr (3: 0) xfe 0 0 0 1 1 0 0 1 1 0 0 0 h h h h h h
peb 2047 peb 2047-16 semiconductor group 34 vn (2:0) version number according to the table below: frame evaluation register (fer) read at indirect address ia (3:0) = f h reset value = xxx after a frame evaluation procedure this 12-bit register contains the input counter offset between the sp frame and an evaluated fs0 fs7 frame. the evaluation is performed at the second following rising edge of fs after the command cmdr:sfe = 1 was programmed. d11 the fs-rising edge was sampled during the clock-high phase (d11 = 1), or during the clock-low phase (d11 = 0). d (10:0) the fs-rising edge was sampled at: input counter value + 1 if d11 = 1 input counter value + 2 if d11 = 0 with a device clock of 8 mhz d0 is fixed to 0 and d (10:1) contain the input counter value. the actual offset between the sp frame and an evaluated fs frame can be calculated by the following formulas: table 9 version number vn2 vn1 vn0 device versions 000a1 0 0 1 v2.1 (b1) bit 7 bit 0 d11 d10 d9 d8 d7 d6 d5 d4 d3 d2 d1 d0 clk 1.024 mhz offset value/number of clock periods d11 fs-rising edge at 8 (d (10:1) h + 01d h ) mod1024 (d (10:1) h + 01e h ) mod1024 0 1 clk low clk high 16 (d (10:0) h + 03d h ) mod2048 (d (10:0) h + 03e h ) mod2048 0 1 clk low clk high 4 (d (9:1) h + 01d h ) mod512 (d (9:1) h + 01e h ) mod512 0 1 clk low clk high
semiconductor group 35 peb 2047 peb 2047-16 definition of the calculated offset value: figure 16 formulas for offset calculation note: the device must be synchronized to sp (star: pss = 1) in order to generate a correct result in fer. itd03780 sp clk 012345678910 .. offset value
peb 2047 peb 2047-16 semiconductor group 36 5 electrical characteristics note: stresses above those listed here may cause permanent damage to the device. exposure to absolute maximum ratings conditions for extended periods may affect device reliability. absolute maximum ratings parameter symbol limit values unit ambient temperature under bias t a 0 to 70 c storage temperature t stg C 65 to 125 c voltage at any pin with respect to ground v s C 0.4 to v dd +0.4 v maximum voltage on any pin v max 7v dc characteristics ambient temperature under bias range; v dd = 5 v 5 %, v ss = 0 v. parameter symbol limit values unit test condition min. max. l-input voltage v il C 0.4 0.8 v h-input voltage v ih 2.2 v dd + 0.4 v l-output voltage v ol 0.45 v i ol = 2 ma h-output voltage h-output voltage v oh v oh 2.4 v dd C 0.5 v v i oh = C 400 m a i oh = C 100 m a operational power supply current f clk = 8192 khz f clk = 16384 khz i cc i cc 20 34 ma ma v dd = 5 v, inputs at 0 v or v dd , no output loads input leakage current output leakage current i li i lo 10 10 m a m a 0 v < v in < v dd to 0 v 0 v < v out < v dd to 0 v capacitances t a = 25 c, v dd = 5 v 5 %, v ss = 0 v. parameter symbol limit values unit min. max. input capacitance c in 10 pf output capacitance c out 15 pf i/o capacitance c io 20 pf
semiconductor group 37 peb 2047 peb 2047-16 ac characteristics ambient temperature under bias range, v dd = 5 v 5 %. inputs are driven at 2.4 v for a logical 1 and at 0.4 v for a logical 0. timing measurements are made at 2.0 v for a logical 1 and at 0.8 v for a logical 0. the ac testing input/output waveforms are shown below. figure 17 i/o waveform for ac tests m p-interface timing parameters parameter symbol limit values unit min. max. ale pulse width t aa 30 ns address setup time to ale t al 10 ns address hold time from ale t la 15 ns address latch setup time to wr , rd t als 0ns address setup time to wr , rd t as 10 ns address hold time from wr , rd t ah 15 ns rd delay after wr setup t dsd 0ns rd pulse width t rr 120 ns data output delay from rd t rd 100 ns data float from rd t df 25 ns rd control interval t ri 70 ns wr pulse width t ww 60 ns data setup time to wr + cs t dw 30 ns data hold time from wr + cs t wd 10 ns wr control interval t wi 70 ns r/w delay after rd setup t rwd 0ns its00568 = 150 pf load c test under device 2.0 0.8 0.8 2.0 test points
peb 2047 peb 2047-16 semiconductor group 38 figure 18 m p-read cycle figure 19 m p-write cycle itt00712 rd x cs ad0 - ad7 t rd data t df rr tt ri itt00713 wr x cs ad0 -ad7 t dw data t wd ww tt wi
semiconductor group 39 peb 2047 peb 2047-16 figure 20 multiplexed address timing figure 21 demultiplexed address timing itt00714 wr x cs ad0 - ad7 t la cs x rd or address ale t als t al t aa t ad itt00715 wr x cs a0 - a5 t ah t as address cs x rd or
peb 2047 peb 2047-16 semiconductor group 40 motorola bus mode figure 22 m p-read cycle figure 23 m p-write cycle figure 24 address timing itt00716 cs x ds d0 - d7 t rd data t df dsd t rr t t ri r/w t rwd itt00717 cs x ds ad0 - ad7 t dw data t wd dsd t ww tt wi r/w rwd t itt00718 cs x ds ad0 t ah t as - ad5
semiconductor group 41 peb 2047 peb 2047-16 pcm-interface characteristics parameter symbol limit values unit condition min. max. clock period clock period low clock period high t cp t cpl t cph 120 50 50 ns ns ns peb 2047 clock period clock period low clock period high t cp t cpl t cph 60 27 23 ns ns ns peb 2047-16 frame setup time frame hold time t fs t fh 15 20 ns ns serial data input setup time serial data input hold time t s t h 15 20 ns ns pcm-input data frequency 8192 khz serial data input setup time serial data input hold time t s t h 15 20 ns ns pcm-input data frequency 16496 khz only peb 2047-16 pcm-serial data output delay time t d 30 ns
peb 2047 peb 2047-16 semiconductor group 42 figure 25 ac characteristics at the pcm interface itd03781 1st bit of frame of frame 1st bit 1st bit of frame 1st bit of frame 1st bit of frame 1st bit 1st bit t cpl t cph t cp t fh t fs t fs t fh t d s t t h h t t s s t t h s t t h t d d t clk sp out (oscr:xfe = 0) (iscr:rre = 0) in in (icsr:rre = 1) (oscr:xfe = 1) out clock rate = 4 x data rate x data rate x data rate = 2 x data rate clock rate out (ocsr:xfe = 1) (icsr:rre = 1) in in (ocsr:rre = 0) (ocsr:xfe = 0) out of frame of frame 2nd bit of frame of frame 2nd bit of frame 2nd bit 1st bit of frame 2nd bit of frame d t 3rd bit of frame of frame 3rd bit
semiconductor group 43 peb 2047 peb 2047-16 figure 26 ac characteristics at the pcm interface t fs fh t t fs fh t t cpl cph t t cp t s h t t h s t itd03782 in (icsr:rre=1) (icsr:rre = 0) in sp clk clock rate = 4 x data rate 1st bit of frame of frame 1st bit
peb 2047 peb 2047-16 semiconductor group 44 6 applications 6.1 determination of mtsl frame delay when switching time slots from the input of the mtsl to its output, the question often arises whether the incoming channel is transmitted in the same frame (0 frame delay), the next frame (1 frame delay), or even in the frame thereafter (2 frames delay). because framing delay is different depending on the selected output port, delay timings have to be calculated separately for all outputs. the following text advises how to do this calculation and delivers a value for minimal or constant delay. a constant delay may be programmed by the control byte bit d12 of iar- register. instructions for use 1. determine the data rate for the input data stream and for the output data stream. e.g. 4 mbit/s for input data stream; 4 mbit/s for output data stream. 2. select a device clock. please note, that not all ouput ports are available for every choice of the device clock (refer to the following table) !! e.g. 8 mhz. 3. determine the constant t d for your special configuration by selecting the corresponding row in the table below (a, b, c or d): e.g. for a 4 mbit/s input- /output- data stream with 8 mhz device clock row a) has to be selected. the table delivers a value t d = 4 for line out0 and t d = 3 for out1 7. a big value for t d also means a big internal switching delay. 1) 2, 4 has the meaning 2,048 mbit/s or 4,096 mbit/s input data rate [mbit/s] output data rate [mbit/s] device clk [mhz] t d for out0 t d for out1 t d for out2 3 t d for out4 7 a) 2, 4 1) 4, 8 2 4 4 8 43 3 3 b) 2, 4 1) 4, 8 4 8 4 8 7 6 6 not available !! c) 2 4, 8, 16 4 8 8 16 65 5 5 d) 2, 4 1) 4, 8, 16 8 16 8 16 11 10 10 not available !!
semiconductor group 45 peb 2047 peb 2047-16 4. determine the constant m. the value for m can be determined by selecting the corresponding row in the table below (a, b or c) for your configuration. e.g. for a 4 mbit/s input- /output- data stream with 8 mhz device clock row a) has to be selected. the table delivers the value m = 1. 5. determine the constant k. the value for k can be determined by selecting the corresponding row in the table below (a, b or c) for your configuration. e.g. for a 4 mbit/s input- /output- data stream with 8 mhz device clock row a) has to be selected and the table delivers the value k = 1. the constant m for different data rates input data rate [mbit/s] output data rate [mbit/s] device clk [mhz] m a) 2, 4 4, 8 2 4 4 8 1 b) 2, 4 4, 8 2 4, 8, 16 4 8 4 8 4 8 8 16 2 c) 2, 4 4, 8, 16 8 16 8 16 4 input data rate [mbit/s] output data rate [mbit/s] device clk [mhz] number of input ts [k] sampled at the same time a) 2 2 4 4 2, 4 4, 8 4, 8 8, 16 4 8 8 16 1 b) 4 8 8 2, 4 4, 8 8, 16 4 8 16 2 c) 16 8, 16 16 4
peb 2047 peb 2047-16 semiconductor group 46 6. by inserting the obtained values for k, m and t d in the table below, minimal and constant frame delays may be calculated for every timeslot (ts). the other constants inserted are: n: this constant is a max. counter value that is obtained by integer division of t d by m. maxi: is the maximal number of input time slots C 1 maxo: is the maximal number of output time slots C 1 please note: a negative value means no entry in the table! example the example below will demonstrate the usage for a system with 8 mhz device clk and 4 mbit/s input and output data streams. before starting the calculation the value n must be found by integer division of t d by m. with the values t d = 4 and m = 1 the value for n = 4. with t d = 3 and m = 1 the value for n = 3. the maximal number of input time slots : maxi = 64 C 1 = 63 the maximal number of output time slots: maxo = 64 C 1 = 63 input ts minimal delay = 0 frame for output ts minimal delay = 1 frame for output ts minimal delay = 2 frames for output ts 0 k(1 kC1) 1 k(2 kC1) 2 k(3 kC1) 3 k(4 kC1) . . maxi+1C(n+1) k maxi-n k t d +(0 m) maxo t d +(1 m) maxo t d +(2 m) maxo t d +(3 m) maxo . maxo + 1 C (n + 1) m+ t d maxo 0( t d C1+0 m) 0( t d C1+1 m) 0( t d C1+2 m) 0( t d C1+3 m) . 0 maxo C (n + 1) m+ t d C maxi+1Cn k maxi C (nC1) k . . maxi+1C2 k maxi-1 k maxi+1C1 k maxi-0 k C t d Cn mmaxo . . t d C2 mmaxo t d C1 mmaxo 0( t d Cn mC1) . . 0( t d C2 mC1) 0( t d C1 mC1) constant delay in [frames] 113
semiconductor group 47 peb 2047 peb 2047-16 frame delay for out0 with t d = 4, k = 1, m = 1, n = 4, maxo = 63, maxi = 63: input ts minimal delay = 0 frame for output ts mminimal delay = 1 frame for output ts minimal delay = 2 frames for output ts 0 1 2 . . 59 463 563 663 . . 63 03 04 05 . . 0 62 C 60 61 62 63 C063 163 263 363 C 0 01 02 constant delay in [frames] 113 frame delay for out1 7 with t d = 3, k = 1, m = 1, n = 4, maxo = 63, maxi = 63: input ts minimal delay = 0 frame for output ts minimal delay = 1 frame for output ts minimal delay = 2 frames for output ts 0 1 2 . . 60 363 463 563 . 63 02 03 04 . . 062 C 61 62 63 C063 163 263 C 0 0 01 constant delay in [frames] 113
peb 2047 peb 2047-16 semiconductor group 48 6.2 example for a mtsl design guaranteeing constant frame delay for all time slots in order to achieve a constant frame delay of all pcm channels switched from input to output, the following work-around is suggested. the device is operated with a 16-mhz clock and 8 8 mhz pcm lives for input and output respectively. the effective switch capacity is reduced to 512 512. figure 27 mtsl operation mode with constant frame delay (frame delay = 1) the general idea in this configuration is to switch all input time-slots, which would be passed to the output in the same frame (input ts# + offset < output ts#), to out [4:7] followed by a switch from in [4:7] to the desired output time-slot at out [0:3]. thus a constant frame delay of one frame can be achieved ( refer to table 10 ). in0 out0 in1 out1 in2 out2 in3 out3 in4 out4 in5 out5 in6 out6 in7 out7 mtsl
semiconductor group 49 peb 2047 peb 2047-16 for a 8 mhz/8 mhz-system for example the following frame delay table can be deduced from the timing diagram: table 10 frame delay input time-slot switched to output time-slot in0 ... in4 or (in4 ... in7 switched to out1 ... out3) 0 C1 2C 3 4C 5 . . . 118 C 119 120 C 121 122 C 123 124 C 125 126 C 127 6 C 127 8 C 127 10 C 127 . . . 124 C 125 126 C 127 C C C 0C 5 0C 7 0C 9 . . . 0 C 123 0 C 125 0 C 127 2 C 127 4 C 127 C C .C . . . C C C 0C 1 0C 3 in4 ... in7 switched to out0 0C 1 2C 3 4C 5 . . . 120 121 122 C 123 124 C 125 126 C 127 7 C 127 9 C 127 11 C 127 . . . 127 C C C C 0C 6 0C 8 0C 10 . . . 0 C 126 0 C 127 1 C 127 3 C 127 5 C 127 C C C . . . C .C 0 0C 2 0C 4 delay/number of frames 012
peb 2047 peb 2047-16 semiconductor group 50 7 package outlines plastic package, p-lcc-44 (smd) (plastic leaded chip carrier) gpl05102 sorts of packing package outlines for tubes, trays etc. are contained in our data book package information. dimensions in mm smd = surface mounted device

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